Leaked images of parts purportedly destined for the next iPhone have leaked online, ahead of the phone’s likely debut later this year.
Published by Japanese parts vendor Moumantai and brought to the eager eyes of the western world by our French friends at nowhereelse.fr, the images show a motherboard that we’re assured will feature in Apple’s next effort.
Although not much appears to be different from the equivalent iPhone 5 component, changes around the side that hosts the camera suggest that we can probably expect some kind of upgrade of the phone’s snapper.
That tallies with separate reports that Apple will equip the iPhone 5S with a 12 megapixel camera this time around.
Unfortunately, the fact that we only get to see one side of the motherboard in the photo means it’s impossible to discern what sort of processor the handset might pack.
Assuming rumours can be believed, though, this will be a quad-core A7 number that brings the iPhone more in line with beefy Android efforts from Samsung and HTC.
However, the most significant change is thought to be a hugely revamped version of the iOS software that will power the seventh-gen iPhone and will be showcased in June at the WWDC gathering of the devs.
